An AI-driven predictive model combined with hybrid simulation methods to assess and predict susceptibility of coated materials to microbially influenced corrosion (MIC) under diverse conditions, informing improvements for MIC resistance in industrial applications.
This innovative solution utilizes an AI-driven predictive model integrated with hybrid simulation methods to effectively assess and predict the susceptibility of coated materials to microbially influenced corrosion (MIC). By simulating microbial biofilm dynamics and environmental factors such as temperature, seasonality, and salinity, the model replicates real-world MIC processes. It differentiates between microbial-induced corrosion and abiotic degradation, providing precise, quantifiable data on coating performance. This information is crucial for targeted improvements in MIC resistance, enhancing the longevity and durability of coatings in various industrial applications.
Key features:
This technology is currently at Technology Readiness Level 3, indicating that it has been demonstrated in a laboratory setting. Future validation will involve controlled biofilm cultures and accelerated corrosion tests under varied environmental conditions to further optimize and validate the model with real-world data.
Western University is a comprehensive public research university in London, Ontario, with a full spectrum of professional and research programs and a strong culture of partnership with industry. Companies engage through co-located labs and shared core facilities, a research and technology park with industry tenancy, and advanced prototyping testbeds that enable scale-up. Integration with major hospital systems and affiliated research institutes supports clinical translation and trials, while co-op and internship pathways provide reliable talent pipelines. Research is backed by competitive funding from NSERC, CIHR, SSHRC, and the Canada Foundation for Innovation, and a dedicated technology transfer office offers IP strategy, licensing, and startup support.