Antiviral cu materials for high-touch surface coatings

Technology
Conceptual
University

Water-based nanostructured copper (Cu) ink designed as a spray-coatable antiviral coating for high-touch surfaces. The eco-friendly ink enables rapid, long-lasting, photocatalytic disinfection without toxic chemicals, retaining efficacy at elevated temperatures and humidity where silver-based alternatives fall short.

Overview

This solution offers a water-based nanostructured copper (Cu) ink that can be spray-coated onto virtually any high-touch surface to provide continuous antiviral and antibacterial protection. Copper's well-documented contact-killing mechanism relies on redox cycling, releasing ions and hydroxyl radicals that generate reactive oxygen species, damaging lipids, proteins, and nucleic acids to destroy viral and bacterial genetic material. The technology addresses a growing need for passive, solid-state disinfection in homes, public spaces, healthcare settings, and transportation hubs, where community-acquired infections remain a persistent concern.

Technical specifications

Key features:

  • Water-based, non-toxic formulation suitable for spray application on diverse surfaces
  • High surface-to-volume ratio from nanostructured Cu, increasing catalytic efficiency
  • Rapid drying on substrates, enabling scalable and easy manufacturability
  • Long-term stability and durability as a solid-state disinfectant
  • Photocatalytic disinfection activity that does not require specific environmental conditions
  • Retained antiviral efficacy at higher temperatures and humidity, outperforming silver-based alternatives
  • Endurance of high temperatures without loss of function
  • Designed for high-touch surfaces including those in home and community environments
Technology readiness level

The nanostructured Cu ink has been successfully synthesized and demonstrated in preliminary testing, confirming fast drying, stability, and antiviral performance on coated surfaces. The research team is now advancing toward a six-month validation program with two specific aims: applying the water-based Cu ink to high-touch surfaces via spray coating, and investigating the structural-antiviral relationships of Cu-coated surfaces to optimize formulation and performance.


About University at Buffalo, State University of New York

University at Buffalo is a comprehensive public research university and a leading campus in the State University of New York system. Industry engagement is anchored by co-located labs on a downtown medical campus, a research and technology park with incubators, shared core facilities, and co-op talent pipelines. Partnerships with regional hospitals enable clinical studies and translation, while proximity to the U.S.–Canada border and the binational Great Lakes corridor facilitates cross‑border collaboration. Research is supported by competitive federal funding from NIH, NSF, DOE, and DoD, alongside New York State innovation programs. A dedicated technology transfer office provides IP management, licensing, and startup support.

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