Innovative system automating adhesion testing with robotics for sample handling and AI for data analysis. Enhances accuracy by integrating high-resolution microscopy and SEM data, optimizing testing efficiency through Bayesian machine learning.
The automated high-throughput adhesion testing system leverages the power of robotics and artificial intelligence to transform the traditional methods of adhesion testing. This innovative system automates sample handling using robotics and utilizes AI for parameter optimization and data analysis. By training machine learning models with high-resolution microscopy and scanning electron microscopy (SEM) data, the system significantly enhances the precision of in-situ measurements, enabling accurate exploration of parameters affecting adhesion failure. This approach addresses the inefficiencies and labor intensiveness of conventional methods, offering a more efficient and precise solution.
Currently at Technology Readiness Level 4, this system has been demonstrated in a laboratory environment. The next steps involve developing a prototype robotic platform that integrates in-situ monitoring and AI analysis capabilities, followed by extensive testing and refinement to ensure commercial viability.
The University of Washington is a large public research university with campuses in Seattle, Bothell, and Tacoma, known for a broad portfolio from fundamental discovery to applied innovation. Industry partners engage through a South Lake Union research campus adjacent to a major life sciences district and through collaboration programs that place faculty and students alongside corporate R&D. The university’s integration with a major academic health system enables clinical translation and large-scale trials. Research is supported by competitive federal funding from NIH, NSF, DOE, and DoD. A dedicated technology transfer office manages IP, licensing, and startup incubation with prototyping resources.