Zasuna Solutions LLC presents a comprehensive approach to reducing metal particulates in fiber drum manufacturing by adapting techniques from related industries like food packaging and automotive. The aim is to cut particulate generation by up to 35% through proven methods.
Zasuna Solutions LLC is pioneering a method to significantly reduce metal particulate contamination in the manufacturing of fiber drums. Drawing inspiration from industries such as food packaging and automotive, which have successfully managed particulate contamination, this solution aims to adapt and optimize existing techniques to address the specific challenges faced during the hemming, crimping, and other mechanical processes in fiber drum production. The ultimate goal is to either eliminate or reduce metal particulate generation by 35%, enhancing the cleanliness and safety of the manufacturing process.
The project involves a thorough examination of established commercial techniques used in various industries to prevent metal damage and particulate formation. Key features of the proposed solution include:
The technology is currently at TRL 6, indicating that a model or prototype has been demonstrated in a relevant environment. The next steps involve refining the solution through testing and optimization, followed by scaling up for commercial implementation.
Zasuna Solutions LLC specializes in consulting services for the food packaging industry. Led by Dr. Subh Chatterjee, the company provides technical expertise in areas such as sustainable polymer systems, printing processes, specialty coatings, adhesives, and UV/EB curing technologies. Their services encompass product formulation, packaging performance criteria, material requirements, and assistance with patent analysis and strategy.
The company leverages decades of R&D and industry experience to support clients with project-based consultations. By focusing on packaging material requirements and process innovations, Zasuna Solutions helps businesses navigate technical challenges related to barrier properties, decoration, and regulatory compliance. Their work is supported by an extensive portfolio of patents covering advances in radiation-curable coatings, ink systems, and fabrication methods for packaging and electronic devices.