Low-Temperature Bonding and Heterogeneous Material Integration for Advanced Semiconductor Packaging
Technology Overview
We are developing low-temperature bonding and heterogeneous material integration technologies for advanced semiconductor packaging and next-generation electronic systems. Our research focuses on reliable bonding between dissimilar materials, including silicon, glass, metals, and polymers, to enable high-density integration of electronic components and functional devices.
About Binghamton University
Binghamton University is a large, comprehensive public research university in the State University of New York system. Industry collaborates on campus through an advanced technologies complex with shared labs and prototyping facilities, and a health sciences campus adjacent to regional hospital partners. A downtown incubator and maker spaces connect faculty and startups with suppliers and manufacturing in New York’s Southern Tier, while co-op and internship pathways build talent pipelines for corporate R&D. Research is supported by competitive federal funding from agencies such as NSF, NIH, DOE, and DoD, with additional state and industry sponsorship. A dedicated technology transfer office streamlines IP protection, licensing, and startup formation.
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