Explore advanced low temperature growth of gallium nitride (GaN) using ultra-high vacuum reactive magnetron sputtering. This method offers a cost-effective, scalable alternative to traditional deposition techniques with potential for high-quality crystalline films.
This research focuses on advancing the growth of gallium nitride (GaN) thin films at temperatures below 400°C using an ultra-high vacuum (UHV) reactive magnetron sputtering system. Developed by the Casamento laboratory at MIT, this method promises a cost-effective and scalable alternative to traditional deposition techniques such as molecular beam epitaxy (MBE) and metalorganic chemical vapor deposition (MOCVD). The primary aim is to achieve high-quality crystalline GaN films with fewer impurities, potentially enhancing their applicability in electronics and optoelectronics.
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The project is currently at Technology Readiness Level 3. Initial experiments have demonstrated the viability of using UHV reactive magnetron sputtering for GaN deposition, with ongoing collaboration to refine and validate the process. Further research and development will focus on detailed structural, chemical, electrical, and optical characterization to enhance the commercialization potential of this technique.
MIT is a private research university known for intensive, interdisciplinary discovery and a global scale of sponsored research. Industry engages through a long-standing corporate partnership program, on-campus collaboration spaces, and shared-use facilities that enable rapid prototyping and characterization. The institute also operates a federally funded R&D center and maintains close adjacency to Kendall Square, allowing company teams to embed with faculty and students and accelerate translation. Research is supported by competitive federal funding from NSF, NIH, DOE, and the Department of Defense. A dedicated technology transfer office, standardized agreements, and an affiliated deep-tech accelerator support IP, licensing, and startup formation.