Polyimide-based covalent organic frameworks for semiconductor packaging
Innovative polyimide-based covalent organic frameworks (PI-COFs) offer next-gen photosensitive insulating materials for semiconductor back-end packaging, enabling precise porosity control and dielectric properties. Validated through in-silico and experimental methods.
Overview
Polyimide-based covalent organic frameworks (PI-COFs) represent a groundbreaking advancement in the field of semiconductor packaging. These materials serve as next-generation photosensitive insulating materials, designed to meet the evolving needs of semiconductor back-end packaging. The modular and crystalline structure of PI-COFs allows for precise control over porosity and functional groups, offering tunable dielectric properties. This innovative approach minimizes traditional trial-and-error processes, accelerating the transition from theoretical concepts to industrial applications.
Technical specifications
- Material Composition: PI-COFs integrate photoactive units compatible with i-line lithography, enabling sub-5 μm resolution patterning.
- Design Process: Combines in-silico modeling (using density functional theory and molecular dynamics) with in-situ experimental synthesis and photopatterning validation.
- Performance Metrics: Focus on achieving low dielectric constants, high thermal resilience, and excellent mechanical stability.
- Validation Techniques: Includes FTIR, UV-vis, TGA, and dielectric measurements, alongside lithographic resolution assessments under industry-relevant conditions.
Technology readiness level
Currently, the technology is at TRL 4, indicating that it has been validated at a laboratory level. Future plans involve extensive experimental validation in collaboration with Panjab University to further assess structural stability and optical performance, aligning with commercialization goals.
About Clarkson University
Clarkson University is a private, national research university with a STEM-oriented character and a multi-campus footprint anchored in Potsdam, New York. Companies engage through a state-designated Center for Advanced Technology in advanced materials that supports industry collaboration and access to applied expertise. A Capital Region campus and a Hudson Valley research site extend reach into New York’s technology and manufacturing corridors, while co-op and internship pathways align talent with corporate R&D needs. Research is backed by competitive federal funding from major U.S. agencies such as the National Science Foundation and National Institutes of Health. A dedicated technology transfer office and the Shipley Center for Innovation provide IP support, incubation, and startup acceleration.
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