Solvent-free nanocoating technology for sustainable packaging barrier performance

Overview

Nfinite Nanotech has developed a nanocoating platform that enables sustainable packaging materials to achieve barrier performance comparable to traditional multi-layer or metallized films. The technology addresses a critical industry challenge: replacing non-recyclable, fossil-fuel-based packaging structures with truly sustainable alternatives without sacrificing product protection. By applying a thin metal-oxide nanocoating to substrates such as PLA, PE, and paper, the solution delivers high oxygen and moisture barrier performance suitable for flexible packaging applications.

The company is currently engaged in six paid customer projects with Consumer Packaged Goods companies and packaging producers, demonstrating strong commercial traction. The technology supports corporate ESG goals by enabling recyclable and compostable packaging structures while maintaining the functional performance required for shelf-stable products.

Technical specifications

• Spatial Atomic Layer Deposition (SALD): A proprietary nanocoating process that deposits ultra-thin metal-oxide films at the nanoscale level
• Solvent-free and sustainable: The coating chemistry eliminates solvents, reducing environmental impact and regulatory complexity
• Open-air application: Unlike conventional ALD, the process operates in open air without requiring a vacuum chamber or plasma environment, significantly reducing capital and operating costs
• Low-temperature processing: Enables coating on heat-sensitive substrates including biopolymers and paper
• In-line integration: The technology is designed to be integrated directly into existing packaging manufacturing lines, supporting scalable production
• Multifunctional properties: Beyond barrier performance, the metal-oxide coatings can provide antimicrobial and UV-blocking capabilities, offering advantages over single-layer alternatives such as EVOH
• Substrate compatibility: Validated on sustainable films including PLA, PE, and paper-based materials

Technology readiness level

The technology is at an advanced stage of commercial validation, currently deployed in six paid pilot projects with CPG companies and packaging producers. The company has demonstrated the ability to achieve customer-specified barrier performance targets and is actively scaling the technology with partners. Near-term validation plans include demonstrating moisture vapor transmission rate below 0.5 and oxygen transmission rate below 1 in a complete packaging structure within six months, followed by packaging tests such as shelf life and drop tests to confirm robustness. The open-air SALD process represents a significant manufacturing innovation that reduces the infrastructure barriers typically associated with thin-film deposition technologies.