Surrogate model accelerated finite-element methods for rapid packaging design

Technology
In development
University

A cutting-edge solution leveraging surrogate model accelerated finite-element solvers to optimize packaging design processes, reduce costs, and enhance recyclability by integrating machine learning and computer graphics.

Overview

The solution utilizes surrogate model accelerated finite-element (FE) solvers to revolutionize commercial packaging design. By integrating advanced machine learning techniques and computer graphics, such as Neural Operators and B-Splines, this approach enhances traditional FE solvers. It accelerates the design process, reduces design-to-shelf costs, and improves packaging integrity and recyclability. This technology is particularly beneficial in generating synthetic datasets and automating mesh generation, thereby significantly reducing the need for costly real-world validation studies.

Technical specifications

Key features:

  • Utilizes surrogate models to enhance finite-element solver capabilities
  • Integrates machine learning and computer graphics for improved performance
  • Applicable to a wide range of materials, including composites, polymers, and metal alloys
  • Capable of automating mesh generation and accelerating solve times by several orders of magnitude
  • Proven applications in predicting material failure and performance in various materials
Technology readiness level

This technology is currently at Technology Readiness Level 6, indicating that it has been demonstrated in a relevant environment. Future validation plans focus on specification, data acquisition, model development, and testing to further refine the solution for commercial deployment.


About The Ohio State University

The Ohio State University is a comprehensive public land‑grant research university in Columbus, serving one of the nation’s largest student populations and a broad research enterprise. Industry partners engage through an integrated academic medical center for clinical translation, a campus‑adjacent innovation district for co‑located projects, and a statewide extension network that pilots solutions across Ohio. Corporate engagement provides a single front door for sponsored research, talent pipelines, and streamlined agreements. Research is supported by competitive federal funding from agencies such as NIH, NSF, DOE, USDA, DoD, and NASA. A dedicated technology transfer office and venture support help protect IP, license technologies, and launch startups.

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