Ultrathin Silicon MEMS Sensors for Flexible, Wearable, and Conformable Electronics

Technology Overview We are developing ultrathin silicon-based MEMS sensors and flexible electronic systems that combine the high sensitivity of semiconductor devices with the mechanical flexibility of polymer substrates. By reducing silicon thickness to the micrometer scale, conventional rigid semiconductor materials can be integrated into bendable and conformable sensing devices. Our technology focuses on ultrathin silicon strain and bending sensors, flexible semiconductor integration, and reliable interfaces between silicon and polymer materials. Industry Challenges and Applications Conventional silicon sensors provide excellent sensitivity and electrical performance but are typically limited by their rigid form factors. Polymer-based flexible sensors offer mechanical compliance but may exhibit limitations in sensitivity, stability, and measurement repeatability. Ultrathin silicon provides an alternative approach by combining semiconductor-based sensing performance with mechanical flexibility. Potential applications include wearable health monitoring, robotic tactile and motion sensing, structural deformation monitoring, flexible medical devices, and industrial condition monitoring. Technical Approach and Capabilities Our research combines semiconductor microfabrication, ultrathin material handling, polymer integration, and mechanical reliability engineering. Key capabilities include:

• Fabrication and integration of ultrathin silicon structures approximately 5–60 µm thick.
• Development of silicon-based strain and bending sensors integrated with flexible polymer substrates.
• Mechanical design and reliability assessment under repeated bending and deformation.
• Characterization of electrical response, sensitivity, repeatability, and fatigue resistance.
• Integration of ultrathin semiconductor sensors into wearable and conformable electronic systems. Experimental Proof of Concept Our ultrathin silicon bending sensor technology has demonstrated:
• Silicon thickness as low as 5 µm integrated with approximately 5 µm polyimide substrates.
• More than 100,000 repeated bending cycles at bending radii of approximately 2.5–5 mm.
• High strain sensitivity, with reported gauge factors exceeding 10,000 under tested conditions.
• Highly repeatable sensor response, with calibration coefficients of determination (R²) exceeding 0.997 under tested conditions. These results demonstrate the feasibility of developing mechanically flexible, high-sensitivity semiconductor sensing devices. Industry Collaboration Opportunities We are seeking industry partners for sponsored research, joint development, and proof-of-concept demonstrations. Potential collaborative projects include:
• Custom ultrathin silicon sensors for specific mechanical deformation and monitoring applications.
• Integration of semiconductor sensors into flexible circuits, wearable devices, and robotic systems.
• Reliability optimization under cyclic bending, stretching, and mechanical loading.
• Development of application-specific sensor packaging and electrical interconnections.
• Prototype development and validation under industry-relevant operating conditions. We welcome collaboration with semiconductor manufacturers, MEMS foundries, medical device companies, robotics developers, and flexible electronics manufacturers.