A novel photosensitive polyimide with non-PAG-based photoreaction enables sub-5 μm patterning for semiconductor RDLs. It offers superior resolution, thermal stability up to 290°C, and dielectric performance, compatible w...
Innovative packaging solutions using honeycomb and foam-core dunnage materials, combined with optimized stacking configurations, aim to reduce membrane roll deformation by over 40% during transport and storage.