Advanced photosensitive polyimide for high-resolution semiconductor packaging
A novel photosensitive polyimide with non-PAG-based photoreaction enables sub-5 μm patterning for semiconductor RDLs. It offers superior resolution, thermal stability up to 290°C, and dielectric performance, compatible with existing i-line photolithography.
Overview
This advanced photosensitive polyimide system is designed to revolutionize semiconductor packaging by enabling sub-5 μm line/space features and vias. Utilizing a non-PAG-based photoreaction mechanism, this material is tailored for compatibility with i-line exposure and existing semiconductor back-end processes. It offers a dielectric constant below 3.5, dielectric loss below 0.01, and exceptional thermal stability up to 290°C, addressing the limitations of current photosensitive materials and supporting continued innovation in miniaturization and performance.
Technical specifications
- Non-PAG-based photoreaction mechanism: Facilitates reliable patterning under i-line exposure.
- High-resolution patterning: Achieves sub-5 μm line/space features and vias.
- Thermal stability: Maintains stability with a glass transition temperature (Tg) above 250°C.
- Dielectric performance: Offers a dielectric constant below 3.5 and dielectric loss below 0.01.
- Compatibility: Works with existing semiconductor back-end equipment and aqueous developers.
- Reliability: Undergoes rigorous thermal and electrical stress testing to ensure long-term stability.
Technology readiness level
Currently at TRL 3, this technology is in the development phase, with ongoing synthesis and characterization of the photosensitive polyimide. The material's properties and patterning capabilities are under evaluation through a series of tests, including thermal stability, dielectric performance, and compatibility with standard semiconductor processes. These efforts aim to validate its performance against industry-standard polyimides and PBOs, focusing on resolution, reliability, and process integration.
About Texas A&M University, College Station
Texas A&M University in College Station is a comprehensive public research university and the flagship of The Texas A&M University System, combining broad academic strengths with a strong applied‑research culture. Industry collaborates on the Texas A&M‑RELLIS campus—an integrated education, research and testing environment that supports large‑scale experimentation and proving grounds—and through the Texas A&M Transportation Institute’s facilities in Bryan‑College Station. A statewide extension network connects university expertise to companies and communities across all Texas counties, enabling rapid piloting and deployment. Research is supported by competitive federal funding from agencies such as NSF, NIH, DOE, USDA and DoD, alongside state and industry sponsorship. Texas A&M Innovation provides IP management, licensing and commercialization pathways across the system.
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