My interests are in advanced packaging techniques to extend Moore's Law in computing. This includes 2D, 2.5D, and 3D packaging techniques. I'm specifically interested in new materials and processing techniques to enable new product architectures. Also of interest is new solutions to efficiently couple light from silicon to fiber to support high volume ramp of co-packaged optics. In addition, I have an interest in developing new materials and technologies to improve thermal performance of high performance computing devices.