A novel method for high-throughput mechanical adhesion measurement using common lab equipment, offering a cost-effective and accessible solution for testing adhesives and coatings.
Northwestern University presents a cutting-edge method for high-throughput measurement of mechanical adhesion in adhesives and coatings. Developed by Muzhou Wang, this technique addresses the needs for efficient and precise evaluation using commonly-available laboratory equipment. The method streamlines testing by utilizing a standard laboratory centrifuge, multiwell plates, and commercially-available microparticles. It provides both qualitative and quantitative analysis, offering significant potential for research and development in adhesive formulations.
Key features:
The process involves depositing sample formulations in multiwell plates, adding colored microspheres, and using centrifugation to assess adhesion. Wells retaining particles indicate higher adhesion, while gradual speed increases allow for detailed quantitative analysis.
This method is at Technology Readiness Level 6, indicating it is tested in a relevant environment and ready for further commercial application. Its efficacy has been demonstrated in published research, showing alignment with conventional testing methods.
Northwestern University is a comprehensive private research university with campuses in Evanston and downtown Chicago and a collaborative, cross‑disciplinary culture. Integration with a major hospital system enables clinical research, diverse patient access, and rapid translation from bench to bedside. Shared research cores, prototyping facilities, a campus incubator, and dedicated corporate engagement teams make it straightforward to scope projects, structure agreements, and place talent. Research is supported by competitive federal funding from agencies such as NIH, NSF, DOE, and DoD, complemented by foundation and industry partnerships. A dedicated technology transfer office advances IP strategy, licensing, and startup formation.