Ion source deposition of diamond-like carbon barrier coating for food packaging
Advanced plasma-based diamond-like carbon (DLC) coating technology for food packaging that significantly reduces water vapor transmission in PET substrates. Developed by Scion Plasma using single beam ion source technology, the process delivers ultra-thin, pinhole-free coatings with excellent mechanical properties and optical clarity.
Overview
Scion Plasma, in collaboration with Fraunhofer USA and Michigan State University, has developed an advanced single beam ion source technology for depositing diamond-like carbon (DLC) coatings that serve as high-performance barrier layers in food packaging. By precisely tuning ion source energy and bias voltage, the technology enables optimized DLC synthesis on polymer substrates such as PET. Validation results demonstrate a substantial reduction in water vapor transmission rate—from 5.985 to 1.452 g/(m²·day)—while maintaining optical transmittance and delivering a Young's modulus of 74 GPa. This combination of barrier performance, mechanical strength, and optical clarity makes the technology well suited for next-generation food packaging applications.
Technical specifications
Key features:
- Single beam ion source effectively dissociates acetylene precursor gas, generating a focused beam for controlled film deposition
- Produces dense, pinhole-free DLC coatings approximately 100 nm thick
- Achieves an optical bandgap of 2.38 eV and Young's modulus of 74 GPa on PET substrates
- Operates within a broader pressure range in the vacuum system, enabling flexible process tuning
- Unique magnetic field design sustains plasma even under low-pressure conditions
- Current round beam ion source supports substrates up to 2" x 2"; planned upgrade to a 10" linear ion source will accommodate substrates up to 6" x 6"
- Enables room-temperature material growth without compromising substrate transmittance
Planned enhancements:
- Exploration of varied pressure ranges and precursor gas concentrations combined with inert gas
- Experimentation with RF, DC, or combined biasing voltage configurations
- Scale-up to larger substrate areas for broader industry applications
Technology readiness level
The technology has been experimentally validated through successful deposition of ultra-thin DLC layers onto PET substrates, confirming significant improvements in barrier properties and mechanical performance. Current capabilities support coating of substrates up to 2" x 2", with an upgrade to a 10" linear ion source underway to expand to 6" x 6" substrates. Future validation efforts will focus on broadening process parameter ranges and scaling deposition area to meet diverse industry requirements.
About Scion Plasma
Scion Plasma LLC is a technology company founded in 2018 as a spin-off from Michigan State University that specializes in advanced plasma solutions for industrial and academic applications. The company develops and manufactures a core portfolio of patented broad-beam ion sources, high-efficiency magnetron sputtering cathodes, and power supplies designed for seamless integration into vacuum systems. Complementing its hardware, Scion Plasma offers ASTRA, a cloud-based simulation software platform that utilizes particle-in-cell Monte Carlo collision (PIC-MCC) methods. By integrating innovative algorithms, this software overcomes traditional computational constraints, allowing researchers and engineers to rapidly simulate low-temperature plasma discharges at industrial scales.
These solutions are engineered to support thin-film deposition, surface engineering, and process optimization in sectors such as semiconductors, electronics, and solar energy. By providing precise control over ion energy and flux, Scion Plasma’s technologies enable benefits like improved film quality, enhanced optical transmittance, and the capability for room-temperature material growth. The company collaborates with researchers and manufacturers to deliver scalable, cost-effective technologies, often supported by government-funded research programs. Their tools help address common manufacturing challenges, such as process stability and material density, ultimately accelerating the development of advanced thin-film materials and plasma-based devices.
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