Low temperature plasma treatment for soybean pathogen inactivation
Innovative cold atmospheric pressure plasma (CAP) technology effectively inactivates soybean pathogens like Fusarium using reactive oxygen and nitrogen species. This environmentally friendly solution integrates with seed processing to reduce pathogen transmission without harming germination.
Overview
The low temperature cold atmospheric pressure plasma (CAP) technology provides an innovative solution for inactivating soybean pathogens such as Fusarium graminearum, Pseudomonas syringae, and Xanthomonas campestris. By employing CAP arrays, this technology generates reactive oxygen and nitrogen species (RONS) using room air to effectively inactivate pathogens without affecting seed germination. This method offers a chemical-free, eco-friendly alternative to traditional treatments, significantly reducing pathogen transmission during seed processing.
Technical specifications
- Large CAP Arrays: Developed with dimensions of 10 cm x 10 cm, these arrays are capable of treating seeds rapidly.
- Inactivation Efficiency: Demonstrated >90% inactivation with smaller arrays in preliminary tests; aims for >99% inactivation in under 60 seconds for larger arrays.
- Environmentally Friendly: Utilizes room air, eliminating the need for harsh chemicals or radiation.
- Seed Compatibility: Proven not to affect seed germination across multiple seed types during testing.
- Integration with Processing Equipment: Designed to integrate with gravity separation tables used in standard seed processing.
Technology readiness level
Currently at Technology Readiness Level 4, the CAP technology has been validated in laboratory settings and is progressing towards optimization and industrial application. Further validation tasks include optimizing array designs for higher plasma density and conducting greenhouse experiments to benchmark against conventional treatments.
About Boise State University
Boise State University is a comprehensive public research university with an applied, partnership‑oriented culture serving the Boise metropolitan region. On‑campus shared core labs and maker spaces enable rapid design and testing, while industry‑sponsored capstones and internships connect companies with faculty and student talent. Its location places researchers near the headquarters and R&D sites of leading technology manufacturers and software firms, supporting co‑located projects and quick‑turn collaboration. Research is backed by competitive federal funding from agencies such as the NSF, NIH, DOE, and DoD, alongside state and industry support. A dedicated technology transfer office and entrepreneurship programs provide IP guidance, licensing, and startup formation.
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